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Thermal Stress and Strain in Microelectronics Packaging

Edited by John Lau
Apr 30, 2012
$220.95
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Overview

Appropriate for
Language
No. of Pages
884
Publisher: Springer US
Shipping dimensions: 9" H x 6" W x 2" L
ISBN: 9781468477696
Life stage: null

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john lau

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