• The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
Free Preview of The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Gerard Kelly
Oct 08, 2012
$160.95
Online pricing. Prices and offers may vary in store.
.
.    Learn More
This product requires a minimum order of  1
Final Sale. No returns or exchanges.
This item will be shipped by appointment through our delivery partner.

Ship to me

Checking availability…

Buy now & pick up in store

Checking availability…

Find it in store

Checking availability…

Earn 805 points and enjoy extra savings with plum+. 

Overview

Appropriate for
Language
English
No. of Pages
134
Publisher: Springer/Sci-Tech/Trade
Shipping dimensions: 9" H x 6" W x 1" L
ISBN: 9781461372769
Life stage: null

You May Also Like

Ratings & Reviews

  • bvseo_sdk, dw_cartridge, 18.2.0, p_sdk_3.2.0
  • CLOUD, getReviews, 5ms
  • reviews, product
  • bvseo-msg: Unsuccessful GET. status = 'ERROR', msg = 'Not Found.'; Unsuccessful GET. status = 'ERROR', msg = 'Not Found.';

Editorial reviews

Author

Others Also Bought

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages 22B32609-6F26-42E4-9D16-6657356C1FEC
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
https://dynamic.indigoimages.ca/v1/books/books/1461372763/1.jpg
160.95
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
https://dynamic.indigoimages.ca/v1/https://cdn.kobo.com/book-images/4a444a32-1bcf-41d4-8cc7-a5203a526aea/300/300/False/image.jpg
135.87
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
https://dynamic.indigoimages.ca/v1/books/books/0792384857/1.jpg
142.95