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Overview
Publisher: Springer US
Shipping dimensions: null
ISBN: 9781461550112
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
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