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Materials for Information Technology: Devices, Interconnects and Packaging

Ehrenfried Zschech Edited by Caroline Whelan , Thomas Mikolajick
Oct 22, 2010
$319.95
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Overview

Appropriate for
Language
English
No. of Pages
508
Engineering Materials and Processes
Publisher: Springer/Sci-Tech/Trade
Shipping dimensions: 9" H x 6" W x 1" L
ISBN: 9781849969673
Life stage: null

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caroline whelan

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