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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

Jennie S. Hwang

20 février 2012

80,50 $

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Description

Langue

anglais

Pages

456

Publié par: Springer/Sci-Tech/Trade

Dimensions à l’expédition: 9" H x 6" W x 1" L

ISBN: 9789401160520

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