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Materials for Information Technology: Devices, Interconnects and Packaging

Ehrenfried Zschech Édition : Caroline Whelan , Thomas Mikolajick

22 octobre 2010

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Description

Langue

anglais

Pages

508

Engineering Materials and Processes

Publié par: Springer/Sci-Tech/Trade

Dimensions à l’expédition: 9" H x 6" W x 1" L

ISBN: 9781849969673

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