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Interconnect Technologies for Integrated Circuits and Flexible Electronics

Édition : Yash Agrawal

17 octobre 2023

181,99 $ ~~Réduction sur le prix courant 226,47 $ à~~

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Description

Langue

anglais

Springer Tracts in Electrical and Electronics Engineering

Publié par: Springer Nature Singapore

ISBN: 9789819944767

Interconnect Technologies for Integrated Circuits and Flexible Electronics

Yash Agrawal Couverture souple
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Wireless Communications Systems Architecture: Transceiver Design and DSP Towards 6G

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Wireless Communications Systems Architecture: Transceiver Design and DSP towards 6G

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Innovations in VLSI, Signal Processing and Computational Technologies: Select Proceedings of the 2nd International Conference, WREC 2023

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Applications of Deep Machine Learning in Future Energy Systems

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FACTS: Modelling and Simulation in Power Networks

Enrique Acha Couverture rigide
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Rheology Of Polymeric Systems: Principles And Applications

Pierre J. Carreau Couverture rigide
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Advanced X-ray Detector Technologies: Design and Applications

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Renewable Energy Systems: Simulation With Simulink And Simpowersystems(tm)

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Advanced X-ray Detector Technologies: Design And Applications

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Power Electronics Step-by-Step: Design, Modeling, Simulation, and Control

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140,95 $
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Nonlinear Biomedical Signal Processing, Volume 1: Fuzzy Logic, Neural Networks, and New Algorithms

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Mobile Networks For Biometric Data Analysis

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Engineering Optimization: Methods and Applications

Gintaras V. Reklaitis Couverture rigide
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Efficient Energy-Saving Control and Optimization for Multi-unit Systems: A Guide for Electrical Engineers

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Distributed Algorithms And Frameworks Of Mobile Networks

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Nano-Structured Photovoltaics: Solar Cells in the Nanotechnology Era

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Advances In Communication, Signal Processing, Vlsi, And Embedded Systems: Select Proceedings Of Vspice 2019

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Integrated Data and Energy Transfer in Wireless Networks

Jie Hu Couverture souple
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Integrated Data and Energy Transfer in Wireless Networks

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Évaluation éditoriale

yash agrawal

Auteur

HEMT Technology and Applications

Trupti Ranjan Lenka Couverture rigide
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Electronics Production Defects and Analysis

Oommen Tharakan Kuttiyil Thomas Couverture souple
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Beyond Si-Based CMOS Devices: Materials to Architecture

Sangeeta Singh Couverture rigide
248,50 $
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5G and Beyond

Bharat Bhushan Couverture rigide
87,95 $
2 formats offerts
Photonic Crystal and Its Applications for Next Generation Systems

Shanmuga Sundar Dhanabalan Couverture rigide
262,95 $
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Microwave Active Devices And Circuits For Communication

Subhash Chandra Bera Couverture rigide
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Cmos Analog Ic Design For 5g And Beyond

Sangeeta Singh Couverture rigide
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Ultra-Low Power Wireless Technologies for Sensor Networks

Brian Otis Couverture souple
233,95 $
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Compressed Sensing for Engineers

Angshul Majumdar Couverture souple
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Advances In 3d Integrated Circuits And Systems

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Nanoscale Vlsi: Devices, Circuits And Applications

Rohit Dhiman Couverture rigide
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Physical Design For 3d Integrated Circuits

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122,95 $
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Applied Op Amp Circuits: Analysis and Design with NI Multisim(tm)

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Power Management Integrated Circuits

Mona M. Hella Couverture souple
136,50 $
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Clocking in Modern VLSI Systems

Thucydides Xanthopoulos Couverture souple
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Robust Control Strategies for Power Electronics in Smart Grid Applications

Yunfei Yin Couverture rigide
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Beamed-mobility Engineering: Wireless-power Beaming to Aircrafts, Spacecrafts and Rockets

Koichi Mori Couverture rigide
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Nanotechnology For Electronics, Photonics, Biosensors, And Emerging Technologies

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Finfet Devices For Vlsi Circuits And Systems

Samar K. Saha Couverture rigide
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Microwave High Power High Efficiency GaN Amplifiers for Communication

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