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Foldable Flex And Thinned Silicon Multichip Packaging Technology

Edited by John W Balde
Jan 31, 2003
$220.95
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Overview

Appropriate for
Language
No. of Pages
347
Emerging Technology In Advanced Packaging
Publisher: Springer US
Shipping dimensions: 10" H x 6" W x 1" L
ISBN: 9780792376767
Life stage: null

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john w balde

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